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L o w R e f e r e n c e H i g h E f f i c i e n c y B o o s t R e g u l a t o r
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
OPERATING RATINGS
Input Voltage Range V BATT ............................ 2.7V to 4.5V
Ambient Temperature Range ................... -40°C to +85°C
Thermal Resistance ......................................................
θ JA (DFN-10) ............................................... 40.5°C/W
θ JA (MSOP-10) .......................................... 214.0°C/W
LX, Vo, V BATT , FLASHOUT, FB to GND pin ......... -0.3 to 6.0V
SHDN, FLASH................................... -0.3V to V BATT +1.0V
VO, GND, LX Current ................................................ 2A
Reverse V BATT Current .......................................... 220mA
Forward V BATT Current.......................................... 500mA
Storage Temperature .............................. -65°C to 150°C
ESD Rating (HBM - Human Body Model) .................. 1.5kV
ELECTRICAL SPECIFICATIONS
Specifications with standard type are for an Operating Ambient Temperature of T A = 27°C only; limits applying over the full
Operating Ambient Temperature range are denoted by a “?”. Minimum and Maximum limits are guaranteed through tes t,
design, or statistical correlation. Typical values represent the most likely parametric norm at T A = 27°C, and are provided
for reference purposes only. Unless otherwise indicated, V BATT = V SHDN = 3.6V, V FB = ZeroV, I LOAD = 0mA, V OUT = 5.0V,
T A = – 40°C to 85°C.
Parameter
Min.
Typ.
Max.
Units
Conditions
Input Voltage Operating Range
V BATT
Output Voltage Range V OUT
Under Voltage Lock-out UVLO
Output Voltage V O
Shutdown Current into V O , I SDO
Shutdown Current into V BATT , I SDB
Efficiency
Inductor Peak Current Limit, I PK
2.7
27
0.5
4.6
-
-
650
-
-
0.61
5.0
1
250
92
800
1600
4.5
5.5
0.7
5.4
500
750
-
1000
V
V
V
V
nA
nA
%
mA
?
?
?
?
?
?
?
After Startup
Internal Feedback Divider
V SHDN = ZeroV
V SHDN = ZeroV, V BATT = 2.7V
V BATT = 2.7V, I OUT = 200mA, R LIM = 2k ?
R LIM = 2k ? , I PK = 1600/R LIM
R LIM = 1k ? , I PK = 1600/R LIM
800
V BATT = 2.7V, R LIM =1k ?
Output Current (Note 2)
400
mA
?
V BATT = 2.7V, R LIM =2k ?
200
V BATT = 2.7V, R LIM = 4k ?
Minimum Off-Time Constant K OFF
Maximum On-Time Constant K ON
Enable Valid to Output Stable
(Note 3)
NMOS Switch Resistance
PMOS Switch Resistance
FB Set Voltage, V FB
FB Input Current
SHDN Input Voltage V IL (Note 1)
SHDN Input Voltage V IH (Note 1)
SHDN Input Current
0.5
2.0
0.76
0.266
-
2.0
1.0
3.5
300
0.30
0.30
0.8
0.288
1
1
1.5
5.0
500
0.6
0.6
0.84
0.310
100
0.5
100
V* μ s
V* μ s
μ s
?
?
V
nA
V
nA
?
?
?
?
?
?
?
?
K OFF ≤T OFF (V OUT - V BATT )
K ON ≥T ON (V BATT )
I LOAD = 1mA
I NMOS = 100mA
I PMOS = 100mA
External feedback Flash = 0
External feedback Flash = 1
V FB =1.3V
V BATT = 2.7V
LX Pin Leakage
3
μ A
FLASH Threshold V IL
FLASH Threshold V IH
1.0
0.4
V
Note 1: SHDN must transition faster than 1V/100mS for proper operation.
Note 2: Output Current I = (VIN/VOUT) x Efficiency x (Inductor Peak Current - Inductor Ripple Current)/2
? 2012 Exar Corporation
2/13
Rev. 2.0.0
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